配方类型:

METALS AND THEIR TREATMENT

配方说明:

Improved Copper Plating

配方组成:

配制方法:

The poor adhesion of copper deposited on steel by chemical replacement using a copper salt in acid solution can be overcome by using Ethoquad C/12 in the salt formulation. In the electroplating of copper the brightness can be increased by adding small quantities of Ethoquad C/25 or Ethoquad 18/25 to the plating.