配方类型:

METAL TREATMENTS

配方说明:

Copper Plating

配方组成:

Sodium Carbonate/30 g/l
Formula No.
Current Density/5.0 A/dm^2
Potassium Hydroxide/4.0 g
Copper/15 g/l
Copper Fluoborate/56 g/l
"Versene"-T/20 g/l
Fluoboric Acid/340 g/l
Boric Acid
Temperature/ambient
Current Density/5.0 A/dm^2
Copper/24 g/l
B: Formaldehyde/37% by weight
Pyrophosphate/185 g/l
P2O7 ^-4/Cu/7.6:1
Ammonia/1.0 g/l
Nitrate/7.0 g/l
pH:/8.2
Orthophosphate/< 60 g/l
Addition agent/0.7 m/l
Temperature/52 C
Current density/4.5
Silver Nitrate/0.2 g
Copper Sulfate (pentahydrate)/5 g/l
Sodium Hydroxide/7 g/l
Distilled Water/100.0 cc
formaldehyde (37% w/v)/10 ml/l
Rochelle Salt/25 g/l
Copper/48 g/l
Rochelle Salt/4.0 g
Copper Sulfate (CuSO4.5H2O)/188 g/l
Sulfuric Acid/75 g/l
Chloride Ion/-
Temperature/ambient
Current Density/5.0 A/dm^2
A: Rochelle Salt/170 g/l
Copper Sulfate (anhydrous)/2.0 g
Copper/15 g/l
Copper Sulfate

配制方法:

Formula No.9 $d: Copper Cyanide/26 g/l Sodium Cyanide/35 g/l Sodium Carbonate/30 g/l Rochelle Salt/45 g/l Copper/19 g/l Free Sodium Cyanide/6.0 g/ pH:/12.6 Temperature/65 C Current density/4.0 A/dm^2