配方类型:

ADHESIVES

配方说明:

Delayed-Tack Adhesive (U.S. Patent No.2,462,029)

配方组成:

Thinned Amine Dispersant/198.0
Diphenyl Phthalate/52.5
"Hycar" OR-25/43.5
"Nevindine" R-3/30.0

配制方法:

This formulation is nontacky at ordinary temperatures and is heat activated at about 150'F. The compound will then remain adhesive down to 50'F. Once set, the adhesive continues to hold at ordinary temperatures.