配方类型:

ADHESIVES

配方说明:

Non-Sag Elevated Temperature Cure Encapsulation Compound

配方组成:

this compound would find application in areas where a non-sag
compound is desired for gun or transfer molding application and elevated
temperature cure. Pot life is over 1 hour at 200'F
"Mistron" Vapor Talc/70
Stearic Acid/1
MPC 66 Black/5
Para-quinone dioxime/4
Pb3O4/10
"Altax"/4
"Whitetex" Clay/30
ZnO/5
"Enjay" Butyl LM 430/100
"Maglite" K/5
"Flexon" 845/50
Molecular Sieve 4A/5

配制方法: