配方类型:

METALS AND TREATMENTS

配方说明:

Copper Plating

配方组成:

Average Current Density, no agitation/75-125 amp/sq ft
Copper Metal (Cu)/60 g/l
Limiting* Current Density at 80'F/150 amp/sq ft
Limiting* Current Density at 120'F/250 amp/sq ft
Operating Conditions pH (colorimetric)/0.8 to 1.7
Average Tank Voltage/3-5
*Maximum Current Density without burning based on laboratory in
thickness using no agitation.
Boric Acid/15 g/l
Temperature/80-170'F
Copper Fluoborate (Cu(BF4)2)/224 g/l
Cathode Current Density:
Baume at 80'F/21' to 22'

配制方法: