配方类型:

METALS AND TREATMENTS

配方说明:

Electroless Lead Plating

配方组成:

Thiourea/35 g
Dimethyl sulfoxide/175 ml
Lead nitrate/35 g

配制方法:

At a temperature of 45'C a smooth, bright lead deposit was obtained on copper. The authors did not try the method on other basis metals; however, if it is unsuitable on steel, a light copper plate could be applied first.