配方类型:

METALS AND THEIR TREATMENT

配方说明:

Cleaning Solder Surfaces

配方组成:

A dip, commonly employed to clean up solder surfaces and to remove
the sulfate film left by etching consists of the following
Thiourea/13 oz/gal
48% fluoboric acid/13 fl oz/gal

配制方法:

This requires about 1-3 minutes at 110-130'F, and a nonionic wetting agent can be added for smoother action.